The problems of thick tin layer formation by ion sputtering in magnetron systems in target vapors
The article describes the process of thick-film tin coating deposition by the ion sputtering in magnetron systems in target vapors realized and studied for the first time. The physics of this deposition method for films of various materials is described and the stages and features of the technological process of deposition of tin coatings are analyzed. The analysis of the arising technological problems such as increased thermal effect on the substrate during the deposition process, unstable process transition into the self-sputtering regime after melting the target, and reduced deposition rate when working with molten tin, not having gone to the self-sputtering regime is performed. The ways of solving the listed problems are proposed, as a result of which the stable process of applying tin coatings with high deposition rates of about 9 μm/min has been worked out. The quality of the samples of the tin coating deposited on ceramic substrates made of aluminum nitride obtained during variations of the deposition process is evaluated.
 Alekseev S.N. Electrovacuumnyepribory [Electronic tubes]. Ulyanovsk, UlSTU Publ., 2003.
 Dukholpelnikov D.V. Magnetronnye raspylitelnye sistemy s electromagnitami. Diss. cand. tekhn. nauk. Avtoreferat [Magnetron sputtering systems with electromagnets. Cand. eng. sc. diss. Author’s abstract]. Moscow, 2007.
 Razumneva N. Pryamaya pechat ptovodyashchikh materialov [Direct printing conducting materials]. Available at: https://www.dipaul.ru/pressroom/pryamaya-pechat-provodyashchikh-materialov/ (accessed August 25, 2017).
 Gamburg Yu.D. Galvanicheskie pokrytiya [Galvanic coatings. Reference book on application]. Moscow, Technosfera Publ., 2006.
 Makarova M.V., Moiseev K.M. Issledovanie svoystv mednykh plenok, poluchennykh metodom ionnogo raspyleniya v magnetronnykh sistemakh v parakh misheni [Investigation of the properties of copper films obtained by ion sputtering in magnetron systems in target vapors]. In: Vakuumnaya tekhnika, materialy i tekhnologii. Sb. trudov 12-y Mezhdunarodnoy nauchno-tekhnichskoy konferentsii [Vacuum technology, materials and technologies. Proceedings of the 12th International Scientific-Technological Conference]. Moscow, 2017, pp. 124-128.
 Makarova M.V., Vasilyev D.D., Moiseev K.M. Protsess ionnogo raspyleniya v magnetronnykh sistemakh v parakh misheni [The process of ion sputtering in magnetron systems in target vapors]. In: Budushchee mashinostroeniya v Rossii. Sb. trudov 9 Vserossiyskoy konferentsii molodykh uchenykh i spetsialistov [The future of mechanical engineering in Russia. Proceedings of the 9th All-Russia Conference of Young Scientists and Specialists]. Moscow, BMSTU Publ., 2016, pp. 298-305.
 Tumarkin A.V., Khodachenko G.V., Stepanova T.V., Shchelkanov I.A. Uspekhi prikladnoy fiziki - Advances in Applied Physics, 2013, vol. 1, no. 3, pp. 276-282.
 Raiser Yu.P. Fizika gazovogo razryada [Physics of gas discharge]. Moscow, Intellect Publ., 2009.
 Grigoryeva I.S., Meilikhova E.Z. Fizicheskie velichiny: spravochnik [Physical quantities: reference book]. Moscow, Energoatomizdat Publ., 2015.
 Dida G.C., Apreutesei M., Arvinte R., Marin A., Cella A.O., Munteanu D. Magnetron sputtering technique used for coatings deposition; technologies and applications. Reports of 7th Intern. Conf. on Materials Science and Engineering BRAMAT. Brasov, 2011, pp 29-33.