Engineering Journal: Science and InnovationELECTRONIC SCIENCE AND ENGINEERING PUBLICATION
Certificate of Registration Media number Эл #ФС77-53688 of 17 April 2013. ISSN 2308-6033. DOI 10.18698/2308-6033
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Article

Active heat sinks as a new concept in microelectronics

Published: 09.10.2014

Authors: Bendryshev Yu.N., Strelov V.I.

Published in issue: #10(34)/2014

DOI: 10.18698/2308-6033-2014-10-1278

Category: Engineering | Chapter: Electronic Engineering

We studied the problem of removing heat generated during the operation of electronic products. A number of carried out experiments proved the effectiveness of micro-pumps usage as a cooling device for semiconductor devices, computers, lasers, LED systems, and so on. We have identified some features of the micropumps use. The obtained results are very important for the development of integrated systems (including MEMS technology).


References
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[2] www.teplostok-plastic.ru